Imisesane yePancake Slip
Iiringi zesiliphu ziyilelwe abo banendawo encinci kakhulu yokuphakama kodwa kunciphiso ekusetyenzisweni kobubanzi, ekwabizwa ngokuba yindandatho yesilayidi esahlukileyo okanye amakhonkco esiliphu sediski, banokusebenzisa iibheringi ezikhoyo kwinkqubo ukunciphisa ukuphakama kwendibano. Ngamanye amagama, iringi yesipinatshi inokungabikho iibheringi.
Iringi yesiliphu sepakeyiki iqulathe icandelo lesangqa kunye nebhloko yebrashi / ibhodi ehambelana nayo, kunye nokuchazwa kwento yokubopha ishafti. I-AOOD ibonelela ngeendlela ezimbini zokufakwa kwesazinge sepancake: I-PCB yohlobo lwesangqa semisesane kunye neengqekembe zohlobo lwesiliphu.
Iingqekembe zesilivere zohlobo lobhedu lwepancake zenziwe ngomsonto we-epoxy resin kwaye zinokumiliselwa okumandla, ubungakanani bazo bunokuba buncinci okanye bukhulu kakhulu, zihlala zisetyenziswa kwiskena se-CT, isiseko se-radar kunye noomatshini bokulungisa. Kwezinye iindlela zokuphakama ezinomda kakhulu, omabini amacala enxalenye yesangqa anokuvulwa ukuze anikeze amandla aphindwe kabini kunye nemisesane yomqondiso wenkqubo, nangaphezulu amakhonkco esiliphu esityibilikayo angasetyenziswa kwinkqubo enye.
I-PCB yohlobo lwepancake slip amakhonkco akhiwe kwindandatho yohlobo lwe-PCB kunye nebhloko yebrashi ehambelanayo, basebenzisa inkqubo esele ikho ukubonelela ngobuncinci bokufakwa, babe nexabiso elicacileyo kwimveliso enkulu.
Zizisombululo ezifanelekileyo zokuhambisa amandla kunye nokuhambisa umqondiso zifuna ubungakanani obulinganiselweyo beenkqubo zoomatshini, umz. Iitafile ezijikelezayo kunye nezihlalo. I-AOOD ibonelela ngeendlela ezimbini zodidi lwe-PCB oluqhelekileyo:
-Ukuhambisa umqondiso we-PCB yohlobo lwepancake slip amakhonkco, iringi nganye ilinganise i-2A ma, eyilelwe ngokukodwa ukuhambisa isignali okanye ukuhambisa okwangoku, ukubonelela ngobubanzi obuncinci bangaphandle kunye nokuphakama kofakelo.
-Ukuhambisa amandla e-PCB yohlobo lwepancake slip amakhonkco, iringi nganye ilinganise i-10A max, inokuhambisa amandla kunye nomqondiso, amakhonkco anokuyilwa kwicala elinye okanye kwicala lesibini le-PCB ukubonelela ngobungqindilili obucekeceke.
